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Polishing Pads, Precision

Chemetall Precision Microchemicals offer a wide range of ChemePol P polishing pads for use with MicroLap E series polishing and Microcut CMP Chemo-Mecahnical Planarizing suspensions. The correct choice of suspension and pad is critical for optimizing removal rate, surface finish, minimizing defectivity and sub-surface damage in the substrate or component. ChemePol P polishing pads are designed with the physical and chemical characteristics of the polishing suspension and substrate material in mind. The polishing or CMP environment is a dynamic interaction of abrasive, chemical and physical actors and a careful orchestration of these is vital for the correct results.

ChemePol P pads and MicroLap E Series Polishing and Microcut CMP Chemo-Mecahnical Planarizing suspensions are engineered to work together in the surface conditioning and finishing of metals, ceramics, glasses and crystalline materials.

Polishing & CMP Engineers, R&D and Production Staff are encouraged to contact Chemetall Precision Microchemicals for detailed information on pad and abrasive suspension selection for their specific applications.

Literature

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SDS Library

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Titration Procedures

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1.800.526.4473 ext. 2355 or
1.908.464.6900 ext. 2355