Lapping & Polishing, Industrial
Flat lapping and polishing is a unique material removal process using loose abrasive slurry on a rotating metal or ceramic plate or polishing pad. The component, which can be virtually any solid material, is retained beneath a weight or pressure disk within a conditioning ring and material is removed by the action of the abrasive particles in the film between the component and the rotating lapping plate or polishing pad.
Depending on a variety of factors including the abrasive type, size, concentration, slurry chemistry, slurry drip rate, lapping/polishing plate/pad material and machining parameters (rotational plate speed/SFM, pressure/PSI), extremely fine surface finishes of the order of Roughness Average, Ra < 19.7 micro inch/0.5 um and flatness 11.4 micro inch/0.29 um can be routinely achieved.
Lapping and polishing technology is used in many industries such as:
- Cutting Tools
- HDD (Hard Disk Drive)
- MEMS (Microelectromechanical Systems)
- Medial Components
- Optical, EO (Electrooptics), Photonics
- Pumps & Valves
- Tool & Die
Chemetall Precision Microchemicals formulates MicroLap E abrasive slurries and suspensions including silicon carbide, aluminum oxide, boron carbide, synthetic diamond, colloidal silica, cerium oxide and lapping vehicles and cleaners for all aspects of materials finishing in their Technical Center in Fremont, CA. Also, the company offers a wide range of custom, precision engineered polishing pads matched to the finishing process.
Lapping & Polishing Engineers, R&D and Production Staff are encouraged to contact Chemetall Precision Microchemicals for detailed product information for application-specific product recommendations.