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Light Emitting Diodes (LED)

Over the last ten years, LED lighting has found its way out of the laboratory and into industry, streets and homes. High energy consuming filament light bulbs are near obsolete from most industrialized countries as the quest for cost effective and efficient energy grows. The Light Emitting Diode (LED) has played a huge role in the emergence of a new lighting industry as it consumes a fraction of the energy used by a traditional light bulb.

LEDs are fabricated on wafers of Sapphire, Silicon Carbide or Gallium Nitride. These crystalline materials are grown in furnaces, ground cylindrically into "logs", diamond wire sawn into wafers and then ground, lapped, polished and chemo-mechanically polished/planarized. An epi-ready finish (an atomically fine surface) on the wafers is necessary so that a film of Gallium Arsenide can be deposited. Only after the critical processes of wafer finishing and film deposition are complete can the LED devices be fabricated.

Chemetall Precision Microchemicals develops and manufactures a range of fluids, abrasive slurries and cleaners to improve all key stages in LED wafer fabrication:

  • Ingot Shaping/Grinding — Coolants
  • Diamond Wire Saw — Coolants & Abrasive Suspension Vehicles
  • Lapping — Diamond Slurries, Alumina Slurries, Boron Carbide Slurries, Silicon Carbide Slurries
  • Polishing/CMP — Diamond Slurries, Alumina Slurries, Colloidal Silica Slurries, Polishing Pads
  • Wafer Backgrind/Backlap/Backpolish/Thin — Coolants, Diamond Slurries, Alumina Slurries, Boron Carbide Slurries, Silicon Carbide Slurries, Colloidal Silica Slurries, Polishing Pads
  • In & Post Process — Cleaners

Engineers, R&D and Production Staff are encouraged to contact Chemetall Precision Microchemicals for detailed technical information for application-specific product recommendations.

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