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Semiconductors

Silicon (Si), Germanium (Ge) and compound semiconductors such as Gallium Arsenide (GaAs) and the III-V/II-VI compounds are grown in ingot form then ground into cylinders, sawn into wafers and ultimately, lapped, polished, chemo-mechanically polished and cleaned. The wafers are fabricated into integrated circuits (IC's) with thousands of chips or other devices per wafer and the fabricated wafers are thinned by backgrinding/backlapping/backpolishing or a combination of these steps.

Chemetall Precision Microchemicals develops and manufactures numerous chemistries for all machining steps including coolants for wire sawing, grinding/backgrinding, wafer dicing/singulation and abrasive slurries including diamond, alumina, ceria, silica zirconia, boron carbide and silicon carbide for lapping and polishing processes and cleaners.

  • Ingot Shaping/Grinding/Sawing — Coolants
  • Diamond Wire Saw — Coolants
  • Lapping & Polishing — Vehicles, Diamond Slurries, Alumina Slurries, Boron Carbide Slurries, Silicon Carbide Slurries, Colloidal Silica Slurries, Polishing Pads
  • Wafer Backgrind/Backlap/Backpolish/Thin — Coolants, Diamond Slurries, Alumina Slurries, Boron Carbide Slurries, Silicon Carbide Slurries
  • In & Post Process — Cleaners

Chemetall Precision Microchemicals offers standard and customized products and encourages Wafer Process Engineers, R&D and Production Staff are encouraged to contact Chemetall Precision Microchemicals for detailed product information for application-specific product recommendations.

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